Name: ACM International Conference on Tangible, Embedded
Start: 2026-03-08T00:00:00
Location: The University of Chicago, 5801 S Ellis Ave

ACM International Conference on Tangible, Embedded

Updated: 05 February 2026, 12:17 PM

Event Details

Date: 08 March 2026

Time: Sun, Mar 8 - Wed, Mar 11

City: Chicago, IL

Country: United States

Location: The University of Chicago, 5801 S Ellis Ave

Location Map

References and Tickets

TEI 2026 - ACM

TEI'26 is the 20th annual conference that presents the latest results in tangible, embedded, and embodied interaction.

TEI 2026: Twentieth International Conference on Tangible ...

TEI'26 is the 20th annual conference that presents the latest results in tangible, embedded, and embodied interaction. The ACM TEI conference has gainedÂ ...

TEI 2026 - SIGCHI

ACM SIGCHI is the leading international ... conference that presents the latest results in tangible, embedded, and embodied interaction. The ACM TEI conferenceÂ ...